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Content
Metal Clad Circuits
Layer count: 1-4L (metal substrate & metal clad board), 1-2L ceramic board
Board thickness: 0.5-7.0 mm; Size: max. 610*610 mm
Thermal conductivity： 1-4W/mk for normal metal material, and 24-170W/mk for ceramic material
Surface finish: HAL, ENIG, ENEPIG, Immertion Tin, Immertion Silver, OSP, etc.
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